Flip-chip micromachine package

ABSTRACT

A micromachine package includes a micromachine chip mounted as a flip chip to a substrate. The micromachine chip includes a micromachine area and bond pads formed on a front surface of the micromachine chip. The substrate includes traces formed on an upper surface of the substrate. The bond pads are coupled to the traces by bumps, e.g., formed of solder. The micromachine package is sealed with a package body formed from a cured limited flow liquid encapsulant to protect the micromachine area from the ambient environment. More particularly, the micromachine chip, the package body and the substrate define a sealed cavity, and the micromachine area is located within the sealed cavity.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to the packaging of electroniccomponents. More particularly, the present invention relates to amicromachine package.

2. Description of the Related Art

Micromachine sensing elements (hereinafter micromachine elements) arewell known. A micromachine element typically includes a miniaturemoveable structure, such as a bridge, cantilevered beam, suspended mass,membrane or capacitive element, which is supported over a cavity formedin a silicon wafer. Since the operation of the micromachine elementdepends upon the moveability of the miniature moveable structure, it iscritical that the package, which includes the micromachine element, doesnot contact the miniature moveable structure in any manner.

FIG. 1 is a cross-sectional view of a structure 8 during the formationof a plurality of micromachine packages in accordance with the priorart. As shown in FIG. 1, a silicon wafer 10 included a plurality ofmicromachine chips 12. Micromachine chips 12 included micromachine areas14 on a front surface 10F of wafer 10. Micromachine areas 14 includedthe miniature moveable structure of the micromachine element.Micromachine chips 12 further included bond pads 16 on front surface 10Fof wafer 10. Bond pads 16 were connected to the internal circuitry ofmicromachine chips 12.

Micromachine chips 12 were often integrally connected together in anarray. Each of micromachine chips 12 in the array was delineated by asingulation street 20, which was located between adjacent micromachinechips 12.

A lid 30 was positioned above wafer 10. Lid 30 included a plurality ofcaps 42 integrally connected to one another. Each cap 42 included amicromachine cavity 32. Each micromachine cavity 32 was positioned overa corresponding micromachine area 14. Generally, micromachine cavities32 were wider than micromachine areas 14.

Each cap 42 further included a bond pad cavity 34. Each bond pad cavity34 was positioned over a corresponding set of bond pads 16 on amicromachine chip 12. Generally, bond pad cavities 34 were wider thanbond pads 16, and were at least as deep as bond pads 16 were tall.

FIG. 2A is a cross-sectional view of structure 8 of FIG. 1 at a furtherstage in fabrication in accordance with the prior art. As shown in FIG.2A, lid 30 was attached to wafer 10. Micromachine cavities 32 werepositioned above corresponding micromachine areas 14. Further, bond padcavities 34 were positioned above corresponding sets of bond pads 16.

FIG. 2B is a cross-sectional view of structure 8 of FIG. 2A at a furtherstage of fabrication in accordance with the prior art. Referring to FIG.2B, a series of shallow cuts were made to remove a portion of each cap42 to expose bond pads 16. Micromachine chips 12 were electricallytested by connecting test probes to bond pads 16. If testing of amicromachine chip 12 indicated that the micromachine chip 12 wasdefective, the micromachine chip 12 and/or corresponding cap 42 wasmarked. For example, micromachine chip 12A was marked as beingdefective. Wafer 10 was then singulated along singulation streets 20.Micromachine chips 12 which were marked as defective were discarded.

Disadvantageously, a cap 42 was attached to a micromachine chip 12 evenif the micromachine chip 12 was defective. The cap 42 and defectivemicromachine chip 12 were discarded. However, since a cap 42 wasattached to the defective micromachine chip 12, the cost associated withthe defective micromachine chip 12 was increased compared to the costassociated with the defective micromachine chip 12 alone. This increasedthe cost of fabricating each batch of micromachine packages. This, inturn, increased the average total cost of fabricating each individualmicromachine package, which passed testing.

After singulation of wafer 10, each good micromachine chip 12 with cap42 was further packaged. FIG. 3 is a cross-sectional view of a singlemicromachine package 40 in accordance with the prior art. As shown inFIG. 3, micromachine chip 12 and cap 42 were attached to a substrate 52.Bond pads 16 were electrically connected to traces 44 by bond wires 46.To prevent accumulation of static charge on cap 42, which would rendermicromachine chip 12 inoperable, cap 42 was electrically connected to aground trace 48 by a bond wire 50. Ground trace 48 was grounded duringuse. Although effective at prevent accumulation of static charge on cap42, grounding cap 42 by electrically connecting cap 42 to ground throughbond wire 50 and ground trace 48 was relatively labor intensive andcomplex which increased the cost of fabricating package 40.

SUMMARY OF THE INVENTION

In accordance with the present invention, a micromachine packageincludes a micromachine chip mounted as a flip chip to a substrate. Themicromachine chip includes a micromachine area and bond pads formed on afront surface of the micromachine chip. The substrate includes tracesformed on an upper surface of the substrate. The bond pads are coupledto the traces by bumps, e.g., formed of solder.

Advantageously, the micromachine package is sealed with a package bodyformed from a cured limited flow liquid encapsulant to protect themicromachine area from the ambient environment. More particularly, themicromachine chip, the package body and the substrate define a cavity,and the micromachine area is located within the cavity.

Recall that in the prior art, the cap was mounted over the micromachinearea. Advantageously, by mounting the micromachine chip as a flip chipto the substrate in accordance with the present invention, therequirement for the cap utilized in the prior art is eliminated. Byeliminating the cap, the materials and labor associated withmanufacturing and installing the cap are also eliminated. Further, sincethe requirement for the cap is eliminated, the requirement for groundingthe cap is also eliminated.

In one embodiment, the limited flow liquid encapsulant is applied in anedge fill configuration for situations requiring a thinner package. Inan edge fill configuration, the limited flow liquid encapsulant contactssides of the micromachine chip.

In another embodiment, a partial overfill configuration is used forthose situations having less restriction on total component height. In apartial overfill configuration, the limited flow liquid encapsulantcontacts sides of the micromachine chip and extends over at least aportion of a back surface of the micromachine chip.

In yet another embodiment, a full overfill configuration is provided forthose situations having little or no restriction on total componentheight. In a full overfill configuration, the limited flow liquidencapsulant contacts sides of the micromachine chip and extends over andcovers the entire back surface of the micromachine chip.

External connectivity configurations, such as a ball grid array (BGA),leadless chip carrier (LCC), or land grid array (LGA) configurations,are provided which are contemplated to be implemented in combination orseparate from the embodiments previously described.

Also in accordance with the present invention, a method of fabricating aflip chip micromachine package includes attaching a micromachine chip asa flip chip to a substrate. The micromachine chip has a micromachinearea on a front surface of the micromachine chip. The method furtherincludes dispensing a limited flow material, e.g., liquid encapsulant,around the micromachine chip. The limited flow material is cured to forma package body. The micromachine chip, the package body, and thesubstrate define a cavity, the micromachine area being located withinthe cavity.

Advantageously, only a micromachine chip which has been tested and foundto operate correctly is attached to the substrate. In this manner, wasteof the substrate is avoided and labor associated with attaching adefective micromachine chip thereto is saved.

Recall that in the prior art, a single lid was attached to a pluralityof micromachine chips while still in wafer form. Thus, in the prior art,a cap was attached to each micromachine chip even if the micromachinechip was defective. Accordingly, caps and labor associated withattaching caps to the defective micromachine chips were wasted in theprior art. Since this waste of the prior art is eliminated, themicromachine package in accordance with the present invention is lessexpensive to manufacture than a micromachine package of the prior art.

These and other features and advantages of the present invention will bemore readily apparent from the detailed description set forth belowtaken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a structure during the formation ofa plurality of micromachine packages in accordance with the prior art.

FIG. 2A is a cross-sectional view of the structure of FIG. 1 at afurther stage in fabrication in accordance with the prior art.

FIG. 2B is a cross-sectional view of the structure of FIG. 2A at afurther stage in fabrication in accordance with the prior art.

FIG. 3 is a cross-sectional view of a single micromachine package inaccordance with the prior art.

FIG. 4 is a cross-sectional view of a micromachine package in accordancewith the present invention.

FIG. 5 is a cross-sectional view of a micromachine package in accordancewith an alternative embodiment of the present invention.

FIG. 6 is a cross-sectional view of a micromachine package in accordancewith yet another alternative embodiment of the present invention.

FIG. 7 is a cross-sectional view of an array of micromachine packagesduring assembly in accordance with the present invention.

FIG. 8 is a cross-sectional view of the array of FIG. 7 at a later stageof assembly.

FIG. 9 is a cross-sectional view of the array of FIG. 8 at a later stageof assembly.

In the following description, the same or similar elements are labeledwith same or similar reference numbers.

DETAILED DESCRIPTION

In accordance with the present invention, a micromachine package 400(FIG. 4) includes a micromachine chip 402 mounted as a flip chip to asubstrate 408. Micromachine chip 402 includes a micromachine area 404and bond pads 406 on a front surface 402F of micromachine chip 402.Substrate 408 includes traces 410 formed on an upper surface 408U ofsubstrate 408. Bond pads 406 are coupled to traces 410 by bumps 412,e.g., formed of solder.

Advantageously, micromachine package 400 is sealed with a package body424 formed from a cured limited flow liquid encapsulant to protectmicromachine area 404 from the ambient environment. More particularly,micromachine chip 402, package body 424 and substrate 408 define acavity 426, and micromachine area 404 is located within cavity 426.

Recall that in the prior art, a cap was mounted over the micromachinearea. Advantageously, by mounting micromachine chip 402 as a flip chipto substrate 408 in accordance with the present invention, therequirement for the cap utilized in the prior art is eliminated. Byeliminating the cap, the materials and labor associated withmanufacturing and installing the cap are also eliminated. Further, sincethe requirement for the cap is eliminated, the requirement for groundingthe cap is also eliminated.

Also in accordance with the present invention, referring now to FIG. 7,a method of fabricating a plurality of micromachine packages in an array700 includes attaching micromachine chips 402 as flip chips to amicromachine substrate 710. Micromachine chips 402 have micromachineareas 404 on front surfaces 402F of micromachine chips 402. The methodfurther includes (FIG. 8) dispensing a limited flow material, e.g.,liquid encapsulant, around micromachine chips 402. The limited flowmaterial is cured to form package bodies 424. Micromachine substrate 710is populated (FIG. 9) with interconnection balls 420 on correspondingpads 418. Array 700 is singulated along singulation streets 712resulting in a plurality of individual micromachine packages 400 (FIG.4).

Advantageously, only micromachine chips 402 which have been tested andfound to operate correctly are attached to micromachine substrate 710.In this manner, waste of substrates 408 of micromachine substrate 710 isavoided and labor associated with attaching micromachine chips 402,which are defective, thereto is saved. This, in turn, minimizes thetotal average cost associated with the fabrication of each batch ofmicromachine packages 400.

Recall that in the prior art, a single lid 30 was attached to aplurality of micromachine chips 12 while still in wafer form (FIGS. 1,2A). Thus, in the prior art, a cap 42 was attached to each micromachinechip 12 even if the micromachine chip was defective. Accordingly, caps42 and labor associated with attaching caps 42 to the defectivemicromachine chips 12 were wasted in the prior art. Since this waste ofthe prior art is eliminated, micromachine package 400 in accordance withthe present invention is less expensive to manufacture than amicromachine package of the prior art.

More particularly, FIG. 4 is a cross-sectional view of a micromachinepackage 400 (hereinafter package 400) in accordance with the presentinvention. Referring to FIG. 4, package 400 includes a micromachine chip402 having a front, e.g., first, surface 402F and a rear, e.g., second,surface 402R. A micromachine area 404 is formed on front surface 402Fand contains a micromachine element. A micromachine element is aminiature moveable structure, such as a bridge, cantilevered beam,suspended mass, membrane or capacitive element, which is supported overa cavity as is well known to those of skill in the art.

Micromachine chip 402 further includes a plurality of bond pads 406 onfront surface 402F of micromachine chip 402. In this embodiment, bondpads 406 are directly adjacent to at least two of the plurality of sides402S of micromachine chip 402, preferably opposite one another. Forexample, bond pads 406 are formed along a first side 402S1 and alsoalong a second side 402S2 opposite first side 402S1 of the plurality ofsides 402S.

Bond pads 406 are connected to the internal circuitry of micromachinechip 402. In order to ensure that maximum cost efficiency is attained inthe manufacturing process, width W1 of micromachine chip 402 is theminimum width that can properly support micromachine area 404 and bondpads 406. By minimizing the material required to form micromachine chip402, the associated costs are similarly minimized.

Micromachine chip 402 is mounted to a substrate 408. Illustratively,substrate 408 is ceramic, printed circuit board, thermoplastic and/ortape although other materials are used in other embodiments. Formed onan upper, e.g., first, surface 408U of substrate 408 are a plurality ofelectrically conductive traces 410. Traces 410 are sometimes calledcapture pads. Bond pads 406 are electrically and physically connected tocorresponding traces 410 by corresponding electrically conductive bumps412.

Traces 410 are electrically connected to corresponding electricallyconductive vias 414, which extend from upper surface 408U to a lower,e.g., second, surface 408L of substrate 408. Vias 414 are electricallyconnected to corresponding electrically conductive traces 416 on lowersurface 408L of substrate 408. Formed on traces 416 are correspondingelectrically conductive pads 418, sometimes called capture pads. Formedon pads 418 are corresponding electrically conductive interconnectionballs 420 such as solder balls. Interconnection balls 420 are used toelectrically connect package 400 to a larger substrate (not shown) suchas a printed circuit mother board.

To illustrate, a first bond pad 406A of the plurality of bond pads 406is electrically connected to a first trace 410A of the plurality oftraces 410 by a first bump 412A of the plurality of bumps 412. Trace410A is electrically connected to a first via 414A of the plurality ofvias 414. Via 414A is electrically connected to a first trace 416A ofthe plurality of traces 416. A first pad 418A of the plurality of pads418 is formed on trace 416A. Formed on pad 418A is a firstinterconnection ball 420A of the plurality of interconnection balls 420.

As set forth above, an electrically conductive pathway between bond pad406A and interconnection ball 420A is formed by bump 412A, trace 410A,via 414A, trace 416A and pad 418A. The other bond pads 406, bumps 412,traces 410, vias 414, traces 416, pads 418 and interconnection balls 420are electrically connected to one another in a similar fashion so arenot discussed further to avoid detracting from the principals of theinvention.

Although a particular electrically conductive pathway between bond pad406A and interconnection ball 420A is described above, in light of thisdisclosure, it is understood that other electrically conductive pathwayscan be formed. For example, substrate 408 is a multi-layered laminatesubstrate and, instead of straight-through vias 414, a plurality ofelectrically conductive traces on various layers in substrate 408 areinterconnected by a plurality of electrically conductive vias to formthe electrical interconnections between traces 410 and 416.

As a further example, vias 414 extend along sides 408S of substrate 408and traces 410 and 416 extend to sides 408S. As another alternative,interconnection balls 420 are distributed in an array format to form aball grid array (BGA) type package. Alternatively, interconnection balls420 are not formed, e.g., to form a metal land grid array (LGA) typepackage or a leadless chip carrier (LCC) type package. As a furtheralternative, upper surface 408U and/or lower surface 408L of substrate408 includes a solder mask(s) in a conventional manner.

Further, in one embodiment, pads 418 are not formed such thatinterconnection balls 420 are formed directly on traces 416. Inaccordance with this embodiment, traces 416 are sometimes called capturepads. As a further alternative, contact metallizations (not shown) areinterposed between various electrical conductors of package 400, e.g.,between bumps 412 and traces 410. Other electrically conductive pathwaymodifications will be obvious to those of skill in the art.

A package body 424, sometimes called a bead, contacts a periphery ofmicromachine chip 402 and secures micromachine chip 402 to substrate408. Generally, package body 424 contacts sides 402S of micromachinechip 402 and upper surface 408U of substrate 408. Typically, packagebody 424 is an electrical insulator. In one embodiment, package body 424is an epoxy dispense material such as Hysol 4323, 4450, 4451.

In this embodiment, package body 424 extends slightly under micromachinechip 402 between front surface 402F of micromachine chip 402 and uppersurface 408U of substrate 408. Package body 424 contacts the peripheryof front surface 402F and encloses bond pads 406 and bumps 412. However,package body 424 only extends to the periphery of micromachine area 404and does not extend to contact micromachine area 404.

To the extent that micromachine chip 402 has a different thermalcoefficient of expansion than substrate 408, package body 424 insuresthat micromachine chip 402 does not become dismounted from substrate 408as a result of differential thermal expansion between micromachine chip402 and substrate 408.

Further, package body 424 forms a seal between the periphery ofmicromachine chip 402 and substrate 408. Thus, micromachine chip 402,package body 424, and substrate 408 define a cavity 426, which issealed. In particular, micromachine area 404 is located within cavity426, which is sealed to protect micromachine area 404 against externalmoisture, dust and contamination. Further, locating micromachine area404 within cavity 426 insures that the micromachine element withinmicromachine area 404 moves freely and functions properly.

Recall that in the prior art, a cap was mounted over the micromachinearea. Advantageously, by inverting micromachine chip 402 and couplingbond pads 406 of micromachine chip 402 to traces 410 of substrate 408 bybumps 412, i.e., by mounting micromachine chip 402 as a flip chip tosubstrate 408, the requirement for the cap utilized in the prior art iseliminated. By eliminating the cap, the materials and labor associatedwith manufacturing and installing the cap are also eliminated. Further,since the requirement for the cap is eliminated, the requirement forgrounding the cap is also eliminated.

In package 400, package body 424 contacts sides 402S, e.g., sides 402S1and 402S2, of micromachine chip 402 and does not contact rear surface402R of micromachine chip 402 opposite front surface 402F. Byrestricting package body 424 in this way, package 400 has a minimalthickness and can readily be utilized in areas having strict componentheight requirements.

FIG. 5 is a cross-sectional view of a micromachine package 500(hereinafter package 500) in accordance with an alternative embodimentof the present invention. Package 500 of FIG. 5 is substantially similarto package 400 of FIG. 4 and only the significant differences arediscussed below

Referring now to FIG. 5, package body 424A contacts a periphery of frontsurface 402F and sides 402S of micromachine chip 402. However, inaccordance with this embodiment, package body 424A also contacts aperiphery of rear surface 402R of micromachine chip 402. In this manner,package body 424A enhances the environmental and physical protection ofmicromachine area 404 and the reliability of package 500.

As used herein, the periphery of front surface 402F is the region offront surface 402F directly adjacent to sides 402S of micromachine chip402. Similarly, the periphery of rear surface 402R is the region of rearsurface 402R directly adjacent to sides 402S of micromachine chip 402.Sides 402S extend between front surface 402F and rear surface 402R.

FIG. 6 is a cross-sectional view of a micromachine package 600(hereinafter package 600) in accordance with yet another alternativeembodiment of the present invention. Package 600 of FIG. 6 issubstantially similar to package 400 of FIG. 4 and only the significantdifferences are discussed below

Referring now to FIG. 6, package body 424B contacts the periphery offront surface 402F and sides 402S of micromachine chip 402. However, inaccordance with this embodiment, package body 424B also entirelycontacts rear surface 402R of micromachine chip 402 and thus enclosesmicromachine chip 402. In this manner, package body 424B maximizes theenvironmental and physical protection of micromachine area 404 and thereliability of package 600.

FIG. 7 is a cross-sectional view of an array 700 of packages 400 duringassembly in accordance with the present invention. Array 700 includes amicromachine substrate 710. Micromachine substrate 710 includes aplurality of individual substrates 408 integrally connected together inan array format, e.g., a 2×2, 3×3, . . . n×m format. Each of substrates408 is delineated by a singulation street 712, which is located betweenadjacent substrates 408. For example, a first singulation street 712A ofthe plurality of singulation streets 712 delineates a first substrate408A of the plurality of substrates 408 from a second substrate 408B ofthe plurality of substrates 408. The other substrates 408 are similarlydelineated from adjacent substrates 408 by corresponding singulationstreets 712.

Substrates 408 include traces 410 on upper surfaces 408U of substrates408. Substrates 408 also include vias 414 extending through substrates408 and traces 416 on lower surfaces 408L of substrates 408. Pads 418are on traces 416. In one embodiment, metallized vias along singulationstreets 712 are combined with conductive lands to provide LCCfootprints.

As shown in FIG. 7, micromachine chips 402 are attached to micromachinesubstrate 710. For example, a first micromachine chip 402A of theplurality of micromachine chips 402 is attached to first substrate 408Aby a first set of bumps 412B of the plurality of bumps 412. The othermicromachine chips 402 are attached to corresponding substrates 408 in asimilar manner. Generally, micromachine chips 402 are attached tocorresponding substrates 408 of micromachine substrate 710 by bumps 412.

To attach micromachine chips 402, each micromachine chip 402 is alignedwith micromachine substrate 710 using any one of a number of alignmenttechniques, e.g., micromachine chips 402 are optically or mechanicallyaligned. Micromachine chips 402 are attached to micromachine substrate710 using any one of a number of techniques. For example, bumps 412,e.g., solder, are formed on bond pads 406 of micromachine chips 402 or,alternatively, on traces 410. In accordance with this embodiment, bumps412 are reflowed, i.e., melted and solidified, to attach bond pads 406to traces 410. In one embodiment, substrate 408 is ceramic and bumps 412are formed of a high-temperature solder as those of skill in the artwill understand. In alternative embodiments, substrate 408 is printedcircuit board, thermoplastic or tape and bumps 412 are formed of alow-temperature solder as those of skill in the art will understand.

Alternatively, bond pads 406 of micromachine chips 402 are attached totraces 410 by bumps 412 formed of an electrically conductive epoxy pasteor film, which is thermally or optically cured. As a furtheralternative, bond pads 406 of micromachine chips 402 are attached totraces 410 by thermal or thermosonic bonding of bumps 412 formed of goldformed on bond pads 406, or alternatively, on traces 410. Generally,bond pads 406 of micromachine chips 402 are physically connected totraces 410. In light of this disclosure, those of skill in the art willunderstand that other methods of attaching micromachine chips 402 tomicromachine substrate 710 can be used.

Advantageously, only micromachine chips 402 which have been tested andfound to operate correctly are attached to micromachine substrate 710.In this manner, waste of substrates 408 is avoided and labor associatedwith attaching micromachine chips 402, which are defective, thereto issaved. This, in turn, minimizes the total average cost associated withthe fabrication of each batch of packages 400.

Recall that in the prior art, a single lid 30 was attached to aplurality of micromachine chips 12 while still in wafer form (FIGS. 1,2A). Thus, in the prior art, a cap 42 was attached to each micromachinechip 12 even if the micromachine chip was defective. Accordingly, caps42 and labor associated with attaching caps 42 to the defectivemicromachine chips 12 were wasted in the prior art. Since this waste ofthe prior art is eliminated, package 400 in accordance with the presentinvention is less expensive to manufacture than a micromachine packageof the prior art.

FIG. 8 is a cross-sectional view of array 700 of FIG. 7 at a later stageof assembly in accordance with this embodiment of the present invention.As shown in FIG. 8, package bodies 424 are formed around the peripheriesof micromachine chips 402. To illustrate, a first package body 424-1 ofthe plurality of package bodies 424 is formed around a periphery offirst micromachine chip 402A. The other package bodies 424 are similarlyformed around the peripheries of the other micromachine chips 402.

Of importance, package bodies 424 are formed in a manner which preventspackage bodies 424 from completely filling the spaces betweenmicromachine chips 402 and micromachine substrate 710. Moreparticularly, package bodies 424 do not contact micromachine areas 404of micromachine chips 402.

Generally, package bodies 424 are formed from a limited flow material,e.g., liquid encapsulant. More particularly, a limited flow material isdispensed around micromachine chips 402 and drawn slightly betweenmicromachine chips 402 and substrates 408 by capillary force. Thelimited flow material is cured to form package bodies 424.

To illustrate, a limited flow material is dispense around micromachinechip 402A and drawn slightly between micromachine chip 402A andsubstrate 408A. The limited flow material is then cured to form packagebody 424-1. For example, an epoxy dispense material, e.g., liquidencapsulant, such as Hysol 4323, 4450, 4451 is applied using a needledispenser and then cured to form package bodies 424.

FIG. 9 is a cross-sectional view of array 700 of FIG. 8 at a later stageof assembly in accordance with this embodiment of the present invention.As shown in FIG. 9, micromachine substrate 710 is populated withinterconnection balls 420 on corresponding pads 418. Array 700 issingulated into a plurality of individual packages 400 (FIG. 4) bysingulating micromachine substrate 710 along singulation streets 712.Singulation can be accomplished using any one of a number ofconventional singulation techniques, e.g., by laser cutting ormechanical sawing through micromachine substrate 710 along singulationstreets 712. Array 700 can also be singulated before interconnectionballs 420 are populated, e.g., after the assembly shown in FIG. 8 iscompleted.

By forming a plurality of packages 400 simultaneously, severaladvantages are realized. One advantage is that it is less laborintensive to handle and process a plurality of packages 400simultaneously rather than to handle and process each package 400 on anindividual basis. By reducing labor, the costs associated with eachpackage 400 is minimized. However, in light of this disclosure, those ofskill in the art will recognize that packages 400 can also bemanufactured on an individual basis if desired.

This application is related to Glenn, co-filed and commonly assignedU.S. patent application Ser. No. 09/608,502, now U.S. Pat. No.6,214,644, issued Apr. 10, 2001, entitled “FLIP-CHIP MICROMACHINEPACKAGE FABRICATION METHOD”, which is herein incorporated by referencein its entirety.

The drawings and the forgoing description gave examples of the presentinvention. The scope of the present invention, however, is by no meanslimited by these specific examples. Numerous variations, whetherexplicitly given in the specification or not, such as differences instructure, dimension, and use of material, are possible. The scope ofthe invention is at least as broad as given by the following claims.

I claim:
 1. A structure comprising: a micromachine chip having amicromachine area and a bond pad, said micromachine area and said bondpad being on a first surface of said micromachine chip; a substratehaving a first trace formed on a first surface of said substrate; a bumpelectrically connecting said bond pad to said first trace; and a packagebody, wherein said package body extends between said first surface ofsaid micromachine chip and said first surface of said substrate.
 2. Thestructure of claim 1 wherein said micromachine chip is mounted as a flipchip to said substrate.
 3. The structure of claim 1, wherein saidmicromachine chip, said package body, and said substrate define acavity.
 4. The structure of claim 3 wherein said micromachine area islocated within said cavity.
 5. The structure of claim 3 wherein saidmicromachine chip further comprises a second surface and sides extendingbetween said first surface of said micromachine chip and said secondsurface of said micromachine chip, said package body contacting saidsides.
 6. The structure of claim 5 wherein said package body contacts aperiphery of said second surface of said micromachine chip directlyadjacent said sides.
 7. The structure of claim 6 wherein said packagebody entirely contacts said second surface of said micromachine chip. 8.The structure of claim 3 wherein said package body encloses said bondpad and said bump.
 9. The structure of claim 1 wherein said package bodyextends to a periphery of said micromachine area.
 10. The structure ofclaim 1 wherein said substrate further comprises a second trace formedon a second surface of said substrate, said second trace beingelectrically connected to said first trace.
 11. The structure of claim10 further comprising a via extending from said first surface of saidsubstrate to said second surface of said substrate, said second tracebeing electrically connected to said first trace by said via.
 12. Thestructure of claim 10 further comprising a pad on said second trace. 13.The structure of claim 12 further comprising an interconnection ball onsaid pad.
 14. The structure of claim 1 wherein said substrate is one ofa plurality of substrates integrally connected together.
 15. Thestructure of claim 1 wherein said micromachine area comprises amicromachine element.
 16. The structure of claim 15 wherein saidmicromachine element comprises a miniature movable structure.
 17. Astructure comprising: a micromachine chip having a micromachine area ona first surface of said micromachine chip; a substrate having a firstsurface; and a package body securing said micromachine chip to saidsubstrate, wherein said package body extends between said first surfaceof said micromachine chip and said first surface of said substrate, andwherein said micromachine chip, said package body, and said substratedefine a cavity, said micromachine area being located within saidcavity.
 18. The structure of claim 17 wherein said micromachine areacomprises a micromachine element.
 19. The structure of claim 18 whereinsaid micromachine element comprises a miniature movable structure.
 20. Astructure comprising: a micromachine chip comprising: a first surface; amicromachine element comprising a miniature movable structure on saidfirst surface; and bond pads on said first surface; a substrate havingtraces formed on a first surface of said substrate; bumps electricallyand physically connecting said bond pads to said traces; and a beadextending between and forming a seal between a periphery of said firstsurface of said micromachine chip and said first surface of saidsubstrate.
 21. A structure comprising: a micromachine chip having amicromachine area and a bond pad on a first surface of said micromachinechip, said micromachine chip having a second surface opposite said firstsurface of said micromachine chip; a substrate having a first traceformed on a first surface of said substrate; a bump electricallyconnecting said bond pad to said first trace; and a package bodyextending between said first surface of said micromachine chip and saidfirst surface of said substrate, and wherein said second surface of saidmicromachine chip is exposed.
 22. The structure of claim 21 wherein saidmicromachine chip has sides extending between said first surface andsaid second surface of said micromachine chip, and wherein at least aportion of said sides of said micromachine chip is in contact with saidpackage body.